Multilayer electronic component having moisture-proof layer on body thereof

ABSTRACT

A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of any one of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the continuation application of U.S. patentapplication Ser. No. 16/834,243 filed on Mar. 30, 2020, which claimsbenefit of priority to Korean Patent Application No. 10-2019-0115902filed on Sep. 20, 2019, in the Korean Intellectual Property Office, thedisclosure of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer electronic component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a laminated chip electroniccomponent, is a chip-type condenser installed on a printed circuit board(PCB) of various electronic products such as imaging devices (or videoapparatuses) like liquid crystal displays (LCDs), plasma display panels(PDPs), and the like, computers, smartphones, portable phones, and thelike, to charge and discharge electricity.

Due to advantages of a miniaturized size and high capacity as well asease of mountability, such MLCCs can be used as a component of variouselectronic devices.

Further, as interest in automotive electronic components has recentlybeen increasing, MLCCs have also been required to have high reliabilityand high mechanical strength so as to be able to be used in automotiveor infotainment systems.

In particular, as occurrences of chip cracking, breakdown due tomoisture penetration, and the like, are regarded as fatal defects, inconsideration of an environment in which the automotive electroniccomponents are used, a method to secure higher moisture resistancereliability is required.

In addition, there is a problem in terms of degraded performance orreliability along with thinning in an existing method and, thus, therehas been increasing need for a new method of resolving such problems.

SUMMARY

An aspect of the present disclosure is to improve moisture resistancereliability.

Another aspect is to secure high capacitance.

However, the above aspects are not limited to the previous descriptionsand will be more clearly understood from the following embodiments.

According to an embodiment in the present disclosure, a multilayerelectronic component includes a body including dielectric layers andfirst and second internal electrodes alternately laminated withrespective dielectric layers interposed therebetween, and first andsecond surfaces opposing each other in a direction by which the internalelectrodes are laminated, third and fourth surfaces connected to thefirst and second surfaces and opposing each other, and fifth and sixthsurfaces connected to the first to fourth surfaces and opposing eachother; a moisture-proof layer disposed on at least one surface of anyone of the first, second, fifth, or sixth surface and containing arare-earth oxide; a first external electrode disposed on the thirdsurface and connected to the first internal electrodes; and a secondexternal electrode disposed on the fourth surface and connected to thesecond internal electrodes.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view schematically illustrating a multilayerelectronic component according to an embodiment of the presentdisclosure;

FIG. 2 is a cross-sectional view of line I-I′ of FIG. 1 ;

FIG. 3 is a cross-sectional view of line II-II′ of FIG. 1 ;

FIG. 4 is a perspective view schematically illustrating a body of FIG. 1;

FIG. 5 is a diagram illustrating a process of forming a moisture-prooflayer in the body;

FIG. 6 is a diagram illustrating the body of FIG. 1 , in which themoisture-proof layer is formed;

FIG. 7 is a perspective view schematically illustrating a body accordingto a modified example; and

FIG. 8 is a perspective view schematically illustrating the body and amoisture-proof layer according to the modified example.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will now be describedin detail with reference to the accompanying drawings. The presentdisclosure, however, may be embodied in many different forms and shouldnot be construed as being limited to the embodiments set forth herein.Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art. Accordingly, the shapes and dimensions ofelements in the drawings may be exaggerated for clarity, and the samereference numerals will be used throughout to designate the same or likeelements.

A thickness and a size of each layer shown in the drawings may beexaggerated, omitted or schematically drawn for the purpose ofconvenience or clarity. The same reference numbers will be assigned thesame elements throughout the drawings. Further, in the specification,when a certain part “includes” a certain component, it is understoodthat other components may be further included but are not excluded,unless otherwise specifically indicated.

In the drawings, a “X direction” may be defined as a “second direction”,an “L direction” or a “length direction”, and a “Y direction” may bedefined as a “third direction”, a “W direction” or a “width direction”,while a “Z direction” may be defined as a “first direction”, a“lamination direction”, a “T direction” or a “thickness direction”.

Multilayer Electronic Component

FIG. 1 is a perspective view schematically illustrating a multilayerelectronic component according to an embodiment of the presentdisclosure, and FIG. 2 is a cross-sectional view of line I-I′ of FIG. 1, while FIG. 3 is a cross-sectional view of line II-II′ of FIG. 1 , andFIG. 4 is a perspective view schematically illustrating a body of FIG. 1.

FIG. 5 is a diagram illustrating a process of forming a moisture-prooflayer in the body.

FIG. 6 is a diagram illustrating the body of FIG. 1 , in which themoisture-proof layer is formed.

A multilayer electronic component according to an embodiment will bedescribed in detail with reference to FIGS. 1 to 6 .

A multilayer electronic component 100 according to an embodiment of thepresent disclosure includes a body 110 including dielectric layers 111and first and second internal electrodes 121 and 122 alternatelylaminated with respective dielectric layers interposed therebetween, andfirst and second surfaces 1 and 2 opposing each other in a direction bywhich the internal electrodes are laminated (Z direction), third andfourth surfaces 3 and 4 connected to the first and second surfaces andopposing each other, and fifth and sixth surfaces 5 and 6 connected tothe first to fourth surfaces 1 to 4 and opposing each other; amoisture-proof layer 117 disposed on at least one surface of any one ofthe first, second, fifth or sixth surface and containing a rare-earthoxide; a first external electrode 131 disposed on the third surface 3and connected to the first internal electrode; and a second externalelectrode 132 disposed on the fourth surface 4 and connected to thesecond internal electrode.

The body 110 includes the first and second internal electrodes 121 and122, which are alternately laminated.

The body 110 is not particularly limited with respect to its shape, butmay have a hexahedral shape as illustrated in the drawings or a shapesimilar thereto. Due to shrinkage of ceramic powder included in the body110 during calcination, the body 110 may not have a hexahedral shapewith completely straight lines but may have a substantially hexahedralshape.

The body 110 may include first and second surfaces 1 and 2 opposing eachother in a thickness direction (Z direction), third and fourth surfaces3 and 4 connected to the first and second surfaces 1 and 2 and opposingother in a length direction (X direction), and fifth and sixth surfaces5 and 6 connected to the first and second surfaces 1 and 2 and to thethird and fourth surfaces 3 and 4 and opposing each other in a widthdirection (Y direction).

A plurality of the dielectric layers 111 forming the body 110 are in acalcined state, and may be integrated in a single body such thatboundaries between neighboring dielectric layers 111 may not be readilyapparent without using a Scanning Electric Microscope (SEM).

According to an embodiment, a material forming the dielectric layers 111are not limited as long as sufficient capacitance can be obtainedtherewith, and may be, for example, a barium titanate (BaTiO₃)-basematerial, a lead complex Perovskite-base material, a strontiumtitanate-base material, or the like. The BaTiO₃-base material mayinclude BaTiO₃ ceramic powder, and examples of the BaTiO₃ ceramic powderare (Ba_(1-x)Ca_(x))TiO₃, Ba(Ti_(1-y)Ca_(y))O₃,(Ba_(1-x)Ca_(x))(Ti_(1-y)Zr_(y))O₃, Ba(Ti_(1-y)Zr_(y))O₃, or the like.

The material forming the dielectric layers 111 may include variousceramic additives, organic solvents, plasticizers, binders, dispersants,or the like, added to the BaTiO₃ powder, or the like, according topurpose of the present disclosure.

Meanwhile, a thickness of the dielectric layer 111 is not particularlylimited.

However, when a thickness of the dielectric layer is less than 0.6 μm,in particular 0.4 μm or less, moisture resistance reliability may bereduced.

The thickness of the dielectric layer 111 may refer to an averagethickness of the dielectric layers 111 disposed between the first andsecond internal electrodes 121 and 122.

The average thickness of the dielectric layers 111 may be measured byimage-scanning a length and thickness (L-T) cross-section of the body110 with an SEM.

For example, the average thickness may be obtained by measuringthicknesses at 30 equidistant points in the length direction of anydielectric layer extracted from the L-T cross-section image of the body110, cut through a central portion thereof in the width direction,scanned using an SEM, and then averaging the measured thicknesses.

The thicknesses at the 30 equidistant points may be measured in acapacitance-generating portion, which refers to a region in which thefirst and second internal electrodes 121 and 122 overlap each other.

The body 110 includes a capacitance-generating portion disposed insidethe body 110 and generating capacitance by including the first internalelectrode 121 and the second internal electrode 122 disposed to opposeeach other with the respective dielectric layer 111 interposedtherebetween, and cover portions 112 and 113 formed in an upper portionand a lower portion of the capacitance-generating portion.

The capacitance-generating portion contributes to capacitance generationof the capacitor and may generate capacitance by repeatedly laminating aplurality of the first and second internal electrodes 121 and 122 withthe respective dielectric layers 111 interposed therebetween.

The upper cover portion 112 and the lower cover portion 113 may beformed by vertically laminating a single layer or at least twodielectric layers on upper and lower surfaces of thecapacitance-generating portion, respectively, and may basically preventthe internal electrodes from being damaged by physical or chemicalstress.

The upper cover portion 112 and the lower cover portion 113 do notinclude internal electrodes and may include the same material as thedielectric layer 111.

Further, the body 110 may include margin portions 114 and 115 disposedon both side surfaces of the capacitance-generating portion,respectively.

The margin portions 114 and 115, as illustrated in FIG. 3 , refer to aregion between both ends of the first and second internal electrodes 121and 122 and a boundary surface of the body 110 in a cross-section of thebody 110 cut in the W-T direction.

The margin portions 114 and 115 may basically prevent the internalelectrodes from being damaged by physical or chemical stress.

The margin portions 114 and 115 do not include internal electrodes andmay include the same material as the dielectric layer 111.

A plurality of the internal electrodes 121 and 122 are disposed tooppose each other with respective dielectric layers 111 therebetween.

The internal electrodes 121 and 122 may include the first and secondinternal electrodes 121 and 122 disposed to oppose each other withrespective dielectric layers 111 interposed therebetween.

The first and second internal electrodes 121 and 122 may be exposed tothe third and fourth surfaces 3 and 4 of the body 110, respectively.

Based on FIGS. 2 to 4 , the first internal electrode 121 may be spacedapart from the fourth surface 4 and exposed through the third surface 3,while the second internal electrode 122 may be spaced apart from thethird surface 3 and exposed through the fourth surface 4. A firstexternal electrode 131 is disposed on the third surface 3 to beconnected to the first internal electrode 121, and a second externalelectrode 132 is disposed on the fourth surface 4 to be connected to thesecond internal electrode 122.

The first and second internal electrodes 121 and 122 may be electricallyseparated from each other by the dielectric layers 111 disposedtherebetween.

The body 110 may be formed by alternately laminating in the thicknessdirection (Z direction) a dielectric layer 111 on which the firstinternal electrode 121 is printed and a dielectric layer 111 on whichthe second internal electrode 122 is printed, followed by calcining thesame.

A material forming the first and second internal electrodes 121 and 122are not particularly limited, and may be a conductive paste containingat least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag),gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) andalloys thereof.

A method for printing the conductive paste may be a screen-printingmethod, a gravure printing method, or the like, but is not limitedthereto.

Thicknesses of the first and second internal electrodes 121 and 122 donot need to be particularly limited; however, it is preferable that thethickness of each of the first and second internal electrodes 121 and122 be 0.4 μm or less so as to easily achieve miniaturization and highcapacitance of a multilayer electronic component.

The thickness of the first and second internal electrodes 121 and 122may refer to an average thickness of the first and second internalelectrodes 121 and 122.

The average thickness of the first and second internal electrodes 121and 122 may be measured by image-scanning an L-T cross-section of thebody 110 using an SEM.

For example, the average thickness may be obtained by measuringthicknesses at 30 equidistant points in the length direction of anyfirst and second internal electrodes extracted from the L-Tcross-section image of the body 110, cut through a central portionthereof in the width direction, scanned using an SEM, and then averagingthe measured thicknesses.

The thicknesses at the 30 equidistant points may be measured in thecapacitance-generating portion, which refers to a region in which thefirst and second internal electrodes 121 and 122 overlap each other.

A moisture-proof layer 117 is disposed on at least any one of the first,second, fifth or sixth surface 1, 2, 5 or 6 and contains a rare-earthoxide.

The moisture-proof layer 117 covers minute pores and cracks to preventmoisture from penetrating into the body through an outer surface of thebody. Further, as the moisture-proof layer 117 is water-repellent due tothe rare-earth oxide contained therein, the moisture-proof layer 117 canmore effectively prevent moisture from penetrating into the body throughthe outer surface of the body.

A rare-earth oxide has low interactions with water molecules due to itsstructural characteristics that an outermost electron shell (orbital)thereof reaches an octet state, thereby disabling hydrogen bonding withthe water molecules and making the rare-earth oxide hydrophobic.Further, the moisture-proof layer 117, by containing the rare-earthoxide, can not only improve moisture resistance reliability but alsoinhibit ion migrations, which gives rise to improved reliability.

Conventionally, methods of coating a silicon resin, a fluorinated waterrepellent, and the like, on a body surface were used to improve moistureresistance reliability. In contrast, the moisture-proof layer 117according to the present disclosure containing a rare-earth oxide isadvantageous in that compared to conventional coating materials such asa silicon resin, a fluorinated water repellent, and the like, themoisture-proof layer 117 has remarkably low moisture permeability andfurther has excellent binding to the body 110.

The rare-earth oxide is not particularly limited, and may be, forexample, one selected from dysprosium oxide (Dy₂O₃), cesium oxide(CeO₂), praseodymium oxide (Pr₆O₁₁), neodymium oxide (Nd₂O₃), samariumoxide (Sm₂O₃), europium oxide (Eu₂O₃), gadolinium oxide (Gd₂O₃), terbiumoxide (Tb₄O₇), holmium oxide (Ho₂O₃), erbium oxide (Er₂O₃), thuliumoxide (Tm₂O₃), ytterbium oxide (Yb₂O₃), and lutetium oxide (Lu₂O₃).

Meanwhile, when the rare-earth oxide is Dy₂O₃, it may have an effect ofimproving compatibility with the body 110, compared to the otherrare-earth oxides. In this regard, it may be more preferable that therare-earth oxide be Dy₂O₃.

A thickness of the moisture-proof layer 117 may be at least 100 nm.

When the thickness of the moisture-proof layer 117 is less than 100 nm,moisture resistance reliability may not be sufficiently improved.

An upper limit does not need to be particularly limited for thethickness of the moisture-proof layer 117 and can be determined inconsideration of capacitance, a size of the capacitor, and the like. Forexample, the thickness of the moisture-proof layer 117 may be 100 μm orless.

Meanwhile, a method for forming the moisture-proof layer 117 containinga rare-earth oxide is not particularly limited, and may be, for example,an atomic layer deposition (ALD) method, a molecular layer deposition(MLD) method, a chemical vapor deposition (CVD) method, a sputteringmethod, or the like.

A more preferable method for forming the moisture-proof layer 117containing a rare-earth oxide involves preparing the rare-earth oxide ina sheet form and spraying the same on the body 110.

Based on FIGS. 4 to 6 , once the body 110 is prepared, sheets containingrare-earth oxides 117 a, 117 b, 117 c and 117 d are formed on the body110 to form a coating layer 117.

A sheet containing the rare-earth oxides may also contain raw materialsforming the dielectric layer 111, and various ceramic additives, organicsolvents, plasticizers, binders, dispersants, or the like, added to theBaTiO₃ powder, or the like, may be added thereto according to purpose ofthe present disclosure.

The moisture-proof layer 117 containing the same material as thedielectric layers 111 is advantageous in that it may have improvedbinding force with the body 110 and its shape is easily controlled. Inone example, the dielectric layers 111 may not include the rare-earthoxide contained in the moisture-proof layer 117. In this case, among thedielectric layers 111 and the moisture-proof layer 117, the rare-earthoxide may be contained only in the moisture-proof layer 117. In anotherexample, even if the dielectric layers 111 includes the rare-earth oxidecontained in the moisture-proof layer 117, a weight percentage of therare-earth oxide in the dielectric layers 111 with respect to the totalweight of the dielectric layers 111 may be less than a weight percentageof the rare-earth oxide in the moisture-proof layer 117 with respect tothe total weight of the moisture-proof layer 117.

The external electrodes 131 and 132 are disposed inside the body 110 andare connected to the internal electrodes 121 and 122. As illustrated inFIG. 2 , the first and second external electrodes 131 and 132respectively connected to the first and second internal electrodes 121and 122 may be included.

For the generation of capacitance, the first and second externalelectrodes 131 and 132 may be electrically connected to the first andsecond internal electrodes 121 and 122, respectively, and the secondexternal electrode 132 may be connected to a potential different fromthat to which the first external electrode 131 is connected.

The first external electrode 131 may be disposed on the third surface 3to be connected to the first internal electrode 121, and the secondexternal electrode 132 may be disposed on the fourth surface 4 to beconnected to the second internal electrode 122.

The first external electrode 131 may extend from the third surface 3 soas to cover a portion of the moisture-proof layer 117, and the secondexternal electrode 131 may extend from the fourth surface 4 so as tocover a portion of the moisture-proof layer 117.

Meanwhile, the external electrodes 131 and 132 may be formed using anymaterial, such as a metal, having electric conductivity. A specificmaterial may be determined considering electric characteristics,structural stability, and the like. Further, the external electrodes 131and 132 may have a multilayer structure.

For example, the external electrodes 131 and 132 may be a calcinedelectrode containing a conductive metal and glass or a resin electrodecontaining a conductive metal and a resin.

Additionally, the external electrodes 131 and 132 may be formed by anALD method, a MLD method, a CVD method, a sputtering method, or thelike.

The external electrodes 131 and 132 may also be formed by spraying asheet containing a conductive metal on the body 110.

Based on FIG. 2 , as a more specified example, the first externalelectrode 131 may include a first electrode layer 131 a disposed to bein contact with the first internal electrode 121 and a first conductiveresin layer 131 b disposed on the first electrode layer 131 a, and thesecond external electrode 132 may include a second electrode layer 132 adisposed to be in contact with the second internal electrode 122, and asecond conductive resin layer 132 b disposed on the second electrodelayer 132 a.

The electrode layers 131 a and 132 a may contain a conductive metal andglass.

The conductive metal included in the electrode layers 131 a and 132 a isnot particularly limited as long as a material thereof can beelectrically connected to the internal electrodes for the generation ofcapacitance. For example, the conductive metal used in the electrodelayers 131 a and 132 a may be at least one of nickel (Ni), copper (Cu),palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn),tungsten (W), titanium (Ti), or alloys thereof.

The conductive resin layers 131 b and 132 b may include a conductivemetal and a base resin.

The conductive metal included in the conductive resin layers 131 b and132 b facilitate an electrical connection with the electrode layers 131a and 132 a.

The conductive metal included in the conductive resin layers 131 b and132 b is not particularly limited as long as a material thereof can beelectrically connected to the electrode layers 131 a and 132 a, and maybe, for example, at least one of nickel (Ni), copper (Cu), palladium(Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W),titanium (Ti), or alloys thereof.

The conductive metal included in the conductive resin layers 131 b and132 b may include at least one of spherical type powder or flake typepowder. That is, the conductive metal may consist of flake type powderonly, spherical type powder only, or both flake type powder andspherical type powder being mixed.

The spherical type powder may not have a completely spherical shape, andfor example, a shape whose length ratio of a major axis to a minor axis(major axis/minor axis) is 1.45 or less.

The flake type powder refers to powder having a flat and long shape, andalthough particularly not limited, but may have a major axis/minor axislength ratio of 1.95 or greater.

The lengths of the major and minor axes of the spherical and flake typepowders may be measured from the image of an X and Z directioncross-section (L-T cross-section) cut through a central portion of themultilayer electronic component in the width (Y) direction, scannedusing an SEM.

The base resin contained in the conductive resin layers 131 b and 132 bis not particularly limited as long as it has bondability and shockabsorption and can be mixed with conductive metal powder to prepare apaste. For example, the base resin may be an epoxy resin.

Meanwhile, the external electrodes 131 and 132 may further includeplating layers 131 c and 132 c disposed on the conductive resin layers131 b and 132 b, respectively, to improve mounting properties.

The plating layers 131 c and 132 c are not particularly limited in termsof types, and may be a plating layer containing at least one of Ni, Sn,Pd, or alloys thereof. The plating layers 131 c and 132 c may be amultilayer structure.

For example, the plating layers 131 c and 132 c may include a Ni-platinglayer and an Sn-plating layer disposed on the Ni-plating layer.

Meanwhile, the moisture-proof layer 117 may be disposed on all of thefirst, second, fifth and sixth surfaces 1, 2, 5, and 6 of the body 110.By being disposed on all of the first, second, fifth and sixth surfacesof the body 110, the moisture-proof layer 117 may have greatly improvedmoisture resistance reliability.

However, the moisture-proof layer 117 is not limited to dispose on allof the first, second, fifth and sixth surfaces of the body 110 in thepresent disclosure, and may be disposed only on the first surface, onthe first and second surfaces, or on the fifth and sixth surfaces.

FIG. 7 is a perspective view schematically illustrating a body 110′according to a modified example, and FIG. 8 is a perspective viewschematically illustrating the body 110′ and a moisture-proof layer 117according to the modified example.

Based on FIGS. 7 and 8 , the moisture-proof layer 117 may be disposed onthe first, second, fifth and sixth surfaces 1, 2, 5, and 6 of the body110, and a first internal electrode 121′ may be spaced apart from thefourth surface 4 and may be exposed through the third, fifth and sixthsurfaces 3, 5 and 6 while the second internal electrode 122′ may bespaced apart from the third surface 3 and may be exposed through thefourth to sixth surfaces 4 to 6.

Accordingly, the first and second internal electrodes 121′ and 122′exposed to the fifth and sixth surfaces 5 and 6 of the body 110′ iscovered by the moisture-proof layer 117 and thus protected from theoutside of a multilayer electronic component.

In other words, the moisture-proof layer 117 performs a function of themargin portions 114 and 115 or the cover portions 112 and 113, therebypreventing the internal electrodes from being damaged by physical orchemical stress.

Further, since the moisture-proof layer 117 performs a function of themargin portions 114 and 115 or the cover portions 112 and 113, anoverlapping surface area of the first and second internal electrodes121′ and 122′ is maximized, and a capacitance per unit volume isincreased.

One of the several effects of the present disclosure is to improvemoisture resistance reliability by disposing a moisture-proof layercontaining a rare-earth oxide in the body.

However, the various advantages of the present disclosure are notlimited to the previous descriptions and will be more clearly understoodfrom the embodiments.

While embodiments have been shown and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component, comprising: abody comprising a capacitance-generating portion including dielectriclayers and first and second internal electrodes alternately laminated inone direction with respective dielectric layers interposed therebetween,and cover portions respectively disposed on an upper portion and a lowerportion of the capacitance-generating portion, the body having first andsecond surfaces opposing each other in the one direction, third andfourth surfaces connected to the first and second surfaces and opposingeach other, and fifth and sixth surfaces connected to the first tofourth surfaces and opposing each other; an oxide layer disposed on thefirst, second, fifth and sixth surface, being spaced apart from thefirst and second internal electrodes, and comprising a rare-earth oxide;a first external electrode disposed on the third surface and connectedto the first internal electrodes; and a second external electrodedisposed on the fourth surface and connected to the second internalelectrodes, wherein a thickness of the oxide layer is less than that ofthe cover portions.
 2. The multilayer electronic component of claim 1,wherein the rare-earth oxide is at least one selected from dysprosiumoxide (Dy₂O₃), cerium oxide (CeO₂), praseodymium oxide (Pr₆O₁₁),neodymium oxide (Nd₂O₃), samarium oxide (Sm₂O₃), europium oxide (Eu₂O₃),gadolinium oxide (Gd₂O₃), terbium oxide (Tb₄O₇), holmium oxide (Ho₂O₃),erbium oxide (Er₂O₃), thulium oxide (Tm₂O₃), ytterbium oxide (Yb₂O₃), orlutetium oxide (Lu₂O₃).
 3. The multilayer electronic component of claim1, wherein the rare-earth oxide is Dy₂O₃.
 4. The multilayer electroniccomponent of claim 1, wherein a thickness of the oxide layer is at least100 nm.
 5. The multilayer electronic component of claim 4, wherein thethickness of the oxide layer is 100 μm or less.
 6. The multilayerelectronic component of claim 1, wherein the oxide layer furthercomprises a same material as the dielectric layers.
 7. The multilayerelectronic component of claim 1, wherein the first internal electrodesare spaced out from the fourth surface of the body and is in contactwith the third, fifth, and sixth surfaces, and the second internalelectrodes are spaced out from the third surface and is in contact withthe fourth, fifth, and sixth surfaces.
 8. The multilayer electroniccomponent of claim 1, wherein the first internal electrodes are spacedout from the fourth, fifth, and sixth surfaces of the body and isexposed through the third surface, and the second internal electrodesare spaced out from the third, fifth, and sixth surfaces and is exposedthrough the fourth surface.
 9. The multilayer electronic component ofclaim 1, wherein the first external electrode comprises a firstelectrode layer in contact with the first internal electrodes, and afirst conductive resin layer disposed on the first electrode layer, andthe second external electrode comprises a second electrode layer incontact with the second internal electrodes, and a second conductiveresin layer disposed on the second electrode layer.
 10. The multilayerelectronic component of claim 9, wherein the first and second electrodelayers comprise a conductive metal and glass.
 11. The multilayerelectronic component of claim 9, wherein the first and second conductiveresin layers comprise a conductive metal and resin.
 12. The multilayerelectronic component of claim 9, further comprising a conductive layerdisposed on each of the first and second conductive resin layers. 13.The multilayer electronic component of claim 1, wherein the oxide layeris hydrophobic.
 14. The multilayer electronic component of claim 1,wherein among the dielectric layers and the oxide layer, the rare-earthoxide is contained only in the oxide layer.
 15. The multilayerelectronic component of claim 1, wherein a weight percentage of therare-earth oxide in the dielectric layers with respect to the totalweight of the dielectric layers is less than a weight percentage of therare-earth oxide in the oxide layer with respect to the total weight ofthe oxide layer.
 16. The multilayer electronic component of claim 1,wherein an average thickness of the dielectric layers is 0.4 μm or less.17. The multilayer electronic component of claim 1, wherein an averagethickness of the first and second internal electrodes is 0.4 μm or less.18. The multilayer electronic component of claim 1, wherein an averagethickness of the dielectric layers is 0.4 μm or less, and an averagethickness of the first and second internal electrodes is 0.4 μm or less.19. A multilayer electronic component, comprising: a body comprising acapacitance-generating portion including dielectric layers and first andsecond internal electrodes alternately laminated in one direction withrespective dielectric layers interposed therebetween, and cover portionsrespectively disposed on an upper portion and a lower portion of thecapacitance-generating portion, the body having first and secondsurfaces opposing each other in the one direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother, and fifth and sixth surfaces connected to the first to fourthsurfaces and opposing each other; an oxide layer disposed on at leastone surface of any one of the first, second, fifth or sixth surface,being spaced apart from the first and second internal electrodes, andcomprising a rare-earth oxide; a first external electrode disposed onthe third surface and connected to the first internal electrodes; and asecond external electrode disposed on the fourth surface and connectedto the second internal electrodes, wherein a thickness of the oxidelayer is less than that of the cover portions, wherein among thedielectric layers and the oxide layer, the rare-earth oxide is containedonly in the oxide layer.
 20. The multilayer electronic component ofclaim 19, wherein the rare-earth oxide is at least one selected fromdysprosium oxide (Dy₂O₃), cerium oxide (CeO₂), praseodymium oxide(Pr₆O₁₁), neodymium oxide (Nd₂O₃), samarium oxide (Sm₂O₃), europiumoxide (Eu₂O₃), gadolinium oxide (Gd₂O₃), terbium oxide (Tb₄O₇), holmiumoxide (Ho₂O₃), erbium oxide (Er₂O₃), thulium oxide (Tm₂O₃), ytterbiumoxide (Yb₂O₃), or lutetium oxide (Lu₂O₃).
 21. The multilayer electroniccomponent of claim 19, wherein the rare-earth oxide is Dy₂O₃.
 22. Themultilayer electronic component of claim 19, wherein a thickness of theoxide layer is at least 100 nm.
 23. The multilayer electronic componentof claim 22, wherein the thickness of the oxide layer is 100 μm or less.24. The multilayer electronic component of claim 19, wherein the oxidelayer further comprises a same material as the dielectric layers. 25.The multilayer electronic component of claim 19, wherein the firstinternal electrodes are spaced out from the fourth surface of the bodyand is in contact with the third, fifth, and sixth surfaces, and thesecond internal electrodes are spaced out from the third surface and isin contact with the fourth, fifth, and sixth surfaces.
 26. Themultilayer electronic component of claim 19, wherein the first internalelectrodes are spaced out from the fourth, fifth, and sixth surfaces ofthe body and is exposed through the third surface, and the secondinternal electrodes are spaced out from the third, fifth, and sixthsurfaces and is exposed through the fourth surface.
 27. The multilayerelectronic component of claim 19, wherein the first external electrodecomprises a first electrode layer in contact with the first internalelectrodes, and a first conductive resin layer disposed on the firstelectrode layer, and the second external electrode comprises a secondelectrode layer in contact with the second internal electrodes, and asecond conductive resin layer disposed on the second electrode layer.28. The multilayer electronic component of claim 27, wherein the firstand second electrode layers comprise a conductive metal and glass. 29.The multilayer electronic component of claim 27, wherein the first andsecond conductive resin layers comprise a conductive metal and resin.30. The multilayer electronic component of claim 27, further comprisinga conductive layer disposed on each of the first and second conductiveresin layers.
 31. The multilayer electronic component of claim 19,wherein the oxide layer is hydrophobic.
 32. The multilayer electroniccomponent of claim 19, wherein a weight percentage of the rare-earthoxide in the dielectric layers with respect to the total weight of thedielectric layers is less than a weight percentage of the rare-earthoxide in the oxide layer with respect to the total weight of the oxidelayer.
 33. The multilayer electronic component of claim 19, wherein anaverage thickness of the dielectric layers is 0.4 μm or less.
 34. Themultilayer electronic component of claim 19, wherein an averagethickness of the first and second internal electrodes is 0.4 μm or less.35. The multilayer electronic component of claim 19, wherein an averagethickness of the dielectric layers is 0.4 μm or less, and an averagethickness of the first and second internal electrodes is 0.4 μm or less.36. A multilayer electronic component, comprising: a body comprising acapacitance-generating portion including dielectric layers and first andsecond internal electrodes alternately laminated in one direction withrespective dielectric layers interposed therebetween, and cover portionsrespectively disposed on an upper portion and a lower portion of thecapacitance-generating portion, the body having first and secondsurfaces opposing each other in the one direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother, and fifth and sixth surfaces connected to the first to fourthsurfaces and opposing each other; an oxide layer disposed on at leastone surface of any one of the first, second, fifth or sixth surface,being spaced apart from the first and second internal electrodes, andcomprising dysprosium oxide; a first external electrode disposed on thethird surface and connected to the first internal electrodes; and asecond external electrode disposed on the fourth surface and connectedto the second internal electrodes, wherein a thickness of the oxidelayer is less than that of the cover portions.
 37. The multilayerelectronic component of claim 36, wherein a thickness of the oxide layeris at least 100 nm.
 38. The multilayer electronic component of claim 37,wherein the thickness of the oxide layer is 100 μm or less.
 39. Themultilayer electronic component of claim 36, wherein the oxide layerfurther comprises a same material as the dielectric layers.
 40. Themultilayer electronic component of claim 36, wherein the first internalelectrodes are spaced out from the fourth surface of the body and is incontact with the third, fifth, and sixth surfaces, and the secondinternal electrodes are spaced out from the third surface and is incontact with the fourth, fifth, and sixth surfaces.
 41. The multilayerelectronic component of claim 36, wherein the first internal electrodesare spaced out from the fourth, fifth, and sixth surfaces of the bodyand is exposed through the third surface, and the second internalelectrodes are spaced out from the third, fifth, and sixth surfaces andis exposed through the fourth surface.
 42. The multilayer electroniccomponent of claim 36, wherein the first external electrode comprises afirst electrode layer in contact with the first internal electrodes, anda first conductive resin layer disposed on the first electrode layer,and the second external electrode comprises a second electrode layer incontact with the second internal electrodes, and a second conductiveresin layer disposed on the second electrode layer.
 43. The multilayerelectronic component of claim 42, wherein the first and second electrodelayers comprise a conductive metal and glass.
 44. The multilayerelectronic component of claim 42, wherein the first and secondconductive resin layers comprise a conductive metal and resin.
 45. Themultilayer electronic component of claim 42, further comprising aconductive layer disposed on each of the first and second conductiveresin layers.
 46. The multilayer electronic component of claim 36,wherein the oxide layer is hydrophobic.
 47. The multilayer electroniccomponent of claim 36, wherein a weight percentage of the rare-earthoxide in the dielectric layers with respect to the total weight of thedielectric layers is less than a weight percentage of the rare-earthoxide in the oxide layer with respect to the total weight of the oxidelayer.
 48. The multilayer electronic component of claim 36, wherein anaverage thickness of the dielectric layers is 0.4 μm or less.
 49. Themultilayer electronic component of claim 36, wherein an averagethickness of the first and second internal electrodes is 0.4 μm or less.50. The multilayer electronic component of claim 36, wherein an averagethickness of the dielectric layers is 0.4 μm or less, and an averagethickness of the first and second internal electrodes is 0.4 μm or less.